TSMC to Open Chip Design Center in Munich as Part of EU Push

Taiwan Semiconductor Manufacturing Co. will open a design center in Munich, part of an effort to establish a bigger footprint in Europe.

“We need to have people here on the ground in order to directly work with the customer,” TSMC’s Deputy Co-Chief Operating Officer Kevin Zhang told reporters in Amsterdam on Tuesday. The new site will support European customers in designing high density chips and will complement TSMC’s first European semiconductor fabrication facility in Dresden, he said.